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| laserparameters [2012/07/13 15:50] – [Table] ns1012 | laserparameters [2012/07/20 19:16] (current) – [Table] brunne |
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| Please share your laser parameters with the group. It doesn't matter if you have different parameters for a material that is posted already, the parameters differ quite a lot depending on the optimization goal: A parameter set that gives fast and clean cuts through silicon might be unfeasable for hatching.\\ | Please share your laser parameters with the group. It doesn't matter if you have different parameters for a material that is posted already, the parameters differ quite a lot depending on the optimization goal: A parameter set that gives fast and clean cuts through silicon might be unfeasable for hatching.\\ |
| ===Wafer level materials=== | ===Wafer level materials=== |
| ^ Material ^ hatch or cut? ^ thickness ^ Power ^ Velocity ^ Pulse frequency ^ hatch parameters or parallel lines ^ Repetitions ^ Project or comments ^ Name ^ | ^ Material ^ hatch or cut? ^ thickness ^ Power ^ Velocity ^ Pulse frequency ^ hatch parameters or parallel lines ^ Repetitions ^ Project or comments ^ Name ^ |
| | Silicon | cut | 300 µm | 100% | 10 mm/s | 20 kHz | 5 lines, 125 µm wide | 16 | fast cut | Brunne | | | Silicon | cut | 300 µm | 100% | 10 mm/s | 20 kHz | 5 lines, 125 µm wide | 16 | fast cut | Brunne | |
| | Silicon | hatch | 250 µm | 100% | 700 mm/s | 20 kHz | 8 hatches, 45° inc. 8µm spacing | 70 | low roughness | Brunne, Wiedenmann | | | Silicon | hatch | 250 µm | 100% | 700 mm/s | 20 kHz | 8 hatches, 45° inc. 8µm spacing | 70 | low roughness | Brunne, Wiedenmann | |
| | Silicon | cut | 500 µm | 100 % | 10 mm/s | 20 kHz | 7 Lines, 180µm wide | 16 | fast cut | Brunne | | | Silicon | cut | 500 µm | 100 % | 10 mm/s | 20 kHz | 7 Lines, 180µm wide | 16 | fast cut | Brunne | |
| | Glass | cut | 1000 µm | 100% | 10 mm/s | 20 kHz | 0,5 mm width | 2? | Bluetape on top | Kamberger | | | Glass | cut | 1000 µm | 100% | 10 mm/s | 20 kHz | 0,5 mm width | 2? | Bluetape on top | Kamberger | |
| | Glass | hatch | 550 µm | 100% | 100 mm/s | 20 kHz | 8 hatches, 45° inc. 8µm spacing | 15 | Hole through glass wafer, works only if the laser power is optimal! | Krausse | | | Glass | hatch | 550 µm | 100% | 100 mm/s | 20 kHz | 8 hatches, 45° inc. 8µm spacing | 15 | Hole through glass wafer, works only if the laser power is optimal! | Krausse | |
| | Glass (wafer) | cut | 500 µm | 100 % | 30 mm/s | 20 kHz | 13 parallel lines, 0.25 mm width, 200% filling | 6 x on top, 18 x in 0.35 mm depth, 3 x in 0.6 mm depth | EAGLE 2 | Stürmer | | | Glass (wafer) | cut | 500 µm | 100 % | 30 mm/s | 20 kHz | 13 parallel lines, 0.25 mm width, 200% filling | 6 x on top, 18 x in 0.35 mm depth, 3 x in 0.6 mm depth | EAGLE 2 | Stürmer | |
| | Cr/Au on glass wafer | cut | 500 nm | 100% | 800 mm/s | 70 kHz | Single line | 22 | Electrical circuits on glass | Krausse | | | Cr/Au on glass wafer | cut | 500 nm | 100% | 800 mm/s | 70 kHz | Single line | 22 | Electrical circuits on glass | Krausse | |
| | Cr/Au on glass wafer | hatch | 500 nm | 100% | 500 mm/s | 20 kHz | hatch StefanK_CrAu | 10 | Electrical circuits on glass | Krausse | | | Cr/Au on glass wafer | hatch | 500 nm | 100% | 500 mm/s | 20 kHz | hatch StefanK_CrAu | 10 | Electrical circuits on glass | Krausse | |
| | spring band steel | hatch | 150 µm | 100% | 20mm/s | 20 kHz | 8 hatches, 45° inc. 8µm spacing, no margin | 20 | Hole | Wiedenmann | | | Pyrex | cut by hatch | 500 µm | | | | | | | Spengler | |
| | Steel sheet | cut | 120 µm | 100% | 10mm/s | 20 kHz | 3 parallel lines, 60 µm wide | 15 | "fast" cut, 0.21 mm/s | Brunne | | |
| | Pyrex | cut using hatch | 500 µm | | | | | | | Spengler | | |
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| | Mylar | cut | 350 µm | 100% | 100 mm/s | 25 kHz | single line | 18 | for small parts insert 1s wait | Wapler | | | Mylar | cut | 350 µm | 100% | 100 mm/s | 25 kHz | single line | 18 | for small parts insert 1s wait | Wapler | |
| | Double-sided sticky foil | cut | 90 µm Tape (10 µm adhesive) | | | 20 kHz | single line | 2 | Transformer | Spengler | | | Double-sided sticky foil | cut | 90 µm Tape (10 µm adhesive) | | | 20 kHz | single line | 2 | Transformer | Spengler | |
| | | PDMS | cut | 550µm | 100% | 50 mm/s | 20 kHz | 250µm trench, 10 parallel lines | 15 | MAXWELL | Brunne | |
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| | ===Metals=== |
| | ^ Material ^hatch or cut?^thickness^Power^Velocity^Pulse frequency^hatch parameters or parallel lines ^Repetitions^Project or comments^ Name ^ |
| | |Aluminum foil|cut|18µm|100%|10mm/s|20kHz|--|3|Microlev - cut through after 1 or 2 rep.|Brunne| |
| | | spring band steel | hatch | 150 µm | 100% | 20mm/s | 20 kHz | 8 hatches, 45° inc. 8µm spacing, no margin | 20 | Hole | Wiedenmann | |
| | | Steel sheet | cut | 120 µm | 100% | 10mm/s | 20 kHz | 3 parallel lines, 60 µm wide | 15 | "fast" cut, 0.21 mm/s | Brunne | |
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