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uvlaser [2012/06/08 10:38] – [Table] brunne | uvlaser [2015/07/28 13:34] (current) – muellera | ||
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**Important links:** | **Important links:** | ||
* **__[[laser: | * **__[[laser: | ||
- | * **__[[laserparameters|Laser parameters]]__** | + | * **__[[laser:laserparameters|Laser parameters]]__** |
* **__[[laser: | * **__[[laser: | ||
+ | \\ | ||
+ | **Check the list " | ||
Our group has access to a UV marking laser, that is owned by the FRIAS institute. It can be used to machine most MEMS materials up to a thickness of 1mm. The quality of the cut depends on the choice of material. Silicon and PDMS can both be cut with an accuracy in the 30 micron scale, depending on the thickness of the cut. The basic machine properties can be found here (in german): {{: | Our group has access to a UV marking laser, that is owned by the FRIAS institute. It can be used to machine most MEMS materials up to a thickness of 1mm. The quality of the cut depends on the choice of material. Silicon and PDMS can both be cut with an accuracy in the 30 micron scale, depending on the thickness of the cut. The basic machine properties can be found here (in german): {{: | ||
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=== How to use the machine === | === How to use the machine === | ||
- | The laser system is operated in the MA lab on the 2nd floor. If you want to use the machine, you need the approval | + | The laser system is operated in the MA lab on the 2nd floor. If you want to use the machine, you need the approval Prof. Wallrabe. After that you can get the introduction to the machine by the [[equipment|responsible person]]. It is split into two parts, the basic introduction and the introduction into alignment and stitching. Each introduction takes about 1.5h. The introduction notes can be downloaded here:\\ |
|{{: | |{{: | ||
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=== Known issues === | === Known issues === | ||
- | * The laser needs at least 30-40 minutes to warm up. After about 10-20 minutes it is possible to start lasing, however the machine doesn' | + | * The laser needs at least 60 minutes to warm up. After about 30 minutes it is possible to start lasing, however the machine doesn' |
* The laser loses power over time. This can be checked by a reference cut into silicon: The following parameters should cut through a piece of 300 µm Si wafer:\\ | * The laser loses power over time. This can be checked by a reference cut into silicon: The following parameters should cut through a piece of 300 µm Si wafer:\\ | ||
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Light bulb for the laser illumination: | Light bulb for the laser illumination: | ||
Light bulb for the microscope illumination: | Light bulb for the microscope illumination: | ||
+ | Security light bulb (orange light on top of the workstation, | ||
===How to measure the linewidth and accuracy of the laser=== | ===How to measure the linewidth and accuracy of the laser=== | ||
A laser cut can be measured most accurately with the Leica DM4000 Microscope. A tutorial on how to perform measurements with it can be found [[microscope_measure|here]].\\ | A laser cut can be measured most accurately with the Leica DM4000 Microscope. A tutorial on how to perform measurements with it can be found [[microscope_measure|here]].\\ | ||
{{: | {{: | ||
+ | |||
+ | ===How to calibrate the axes=== | ||
+ | [[laser: | ||
+ | |||
+ | ===Pics of the wiring inside the laser head=== | ||
+ | {{: | ||
=== History of repairs/ | === History of repairs/ | ||
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| April 2012 | New scanner head doesn' | | April 2012 | New scanner head doesn' | ||
| May 2012 | Laser out of focus! | | May 2012 | Laser out of focus! | ||
- | | 08.06.2012 | + | | 08.06.2012 |
+ | | 12.06.2012 | ||
+ | | 02.07.2012 | ||
+ | | 30.07.2012 | ||
+ | | 24.07.2012 | ||
+ | |||
+ | |||
\\ | \\ | ||
It is possible to check the laser power, however this must only be done by the person responsible for the laser! When in doubt: Contact the TRUMPF support. {{: | It is possible to check the laser power, however this must only be done by the person responsible for the laser! When in doubt: Contact the TRUMPF support. {{: |