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uvlaser [2012/07/24 15:54] – brunneuvlaser [2015/07/28 13:34] (current) – muellera
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 **Important links:** **Important links:**
   * **__[[laser:lasercalibration|Laser calibration]]__**   * **__[[laser:lasercalibration|Laser calibration]]__**
-  * **__[[laserparameters|Laser parameters]]__**+  * **__[[laser:laserparameters|Laser parameters]]__**
   * **__[[laser:lasercalendar|Laser calendar]]__**   * **__[[laser:lasercalendar|Laser calendar]]__**
 +\\
 +**Check the list "History of Repairs and Service" at the end of this page for current issues with the machine.**\\
  
 Our group has access to a UV marking laser, that is owned by the FRIAS institute. It can be used to machine most MEMS materials up to a thickness of 1mm. The quality of the cut depends on the choice of material. Silicon and PDMS can both be cut with an accuracy in the 30 micron scale, depending on the thickness of the cut. The basic machine properties can be found here (in german): {{:laserdaten.pdf|Laser properties}}. The system is equipped with an alignment system so that wafer substrates can be accurately processed.\\ \\ Our group has access to a UV marking laser, that is owned by the FRIAS institute. It can be used to machine most MEMS materials up to a thickness of 1mm. The quality of the cut depends on the choice of material. Silicon and PDMS can both be cut with an accuracy in the 30 micron scale, depending on the thickness of the cut. The basic machine properties can be found here (in german): {{:laserdaten.pdf|Laser properties}}. The system is equipped with an alignment system so that wafer substrates can be accurately processed.\\ \\
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 === How to use the machine === === How to use the machine ===
-The laser system is operated in the MA lab on the 2nd floor. If you want to use the machine, you need the approval of both Prof. Korvink and Prof. Wallrabe. After that you can get the introduction to the machine by the [[equipment|responsible person]]. It is split into two parts, the basic introduction and the introduction into alignment and stitching. Each introduction takes about 1.5h. The introduction notes can be downloaded here:\\+The laser system is operated in the MA lab on the 2nd floor. If you want to use the machine, you need the approval Prof. Wallrabe. After that you can get the introduction to the machine by the [[equipment|responsible person]]. It is split into two parts, the basic introduction and the introduction into alignment and stitching. Each introduction takes about 1.5h. The introduction notes can be downloaded here:\\
  
 |{{:anleitung_laser_englisch_08_2011.pdf|Laser intructions}}|{{:anleitung_alignment_englisch_08_2011.pdf|Alignment instructions}}|{{:anleitung_stepping_englisch_08_2011.pdf|Stitching instructions}}|\\ |{{:anleitung_laser_englisch_08_2011.pdf|Laser intructions}}|{{:anleitung_alignment_englisch_08_2011.pdf|Alignment instructions}}|{{:anleitung_stepping_englisch_08_2011.pdf|Stitching instructions}}|\\
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 === Known issues === === Known issues ===
-  * The laser needs at least 30-40 minutes to warm up. After about 10-20 minutes it is possible to start lasing, however the machine doesn't have it's full power yet. In order to get to a defined state, you will need to cut for at least 10 minutes into a dummy substrate, just leaving the machine switched on won't do the trick!+  * The laser needs at least 60 minutes to warm up. After about 30 minutes it is possible to start lasing, however the machine doesn't have it's full power yet. In order to get to a defined state, you will need to cut for at least 30 minutes into a dummy substrate, just leaving the machine switched on won't do the trick!
   * The laser loses power over time. This can be checked by a reference cut into silicon: The following parameters should cut through a piece of 300 µm Si wafer:\\   * The laser loses power over time. This can be checked by a reference cut into silicon: The following parameters should cut through a piece of 300 µm Si wafer:\\
  
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 Light bulb for the laser illumination: 12V/20W 36° GU5.3 (ordered from www.spezilamp.de, order#101449)\\ Light bulb for the laser illumination: 12V/20W 36° GU5.3 (ordered from www.spezilamp.de, order#101449)\\
 Light bulb for the microscope illumination: 21V/150W GX5,3 (ordered from www.spezilamp.de, order#101043)\\ Light bulb for the microscope illumination: 21V/150W GX5,3 (ordered from www.spezilamp.de, order#101043)\\
 +Security light bulb (orange light on top of the workstation, laser won't work if both lamps are broken): BA15D 5W 24V (ordered from www.conrad.de, order#585106 - 62) \\
  
 ===How to measure the linewidth and accuracy of the laser=== ===How to measure the linewidth and accuracy of the laser===
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 | 08.06.2012  | Laser out of focus                                          | Optic offset adjusted to 116 --> No defocus                       | Trumpf service will continue to investigate the problem                                                                                                        | | 08.06.2012  | Laser out of focus                                          | Optic offset adjusted to 116 --> No defocus                       | Trumpf service will continue to investigate the problem                                                                                                        |
 | 12.06.2012  | Error: Cooling water flow is too low                        | Cooling water @ 77%, filled to 100%; cleaned particulate filter.  | New filter needs to be ordered                                                                                                                                 | | 12.06.2012  | Error: Cooling water flow is too low                        | Cooling water @ 77%, filled to 100%; cleaned particulate filter.  | New filter needs to be ordered                                                                                                                                 |
-| 02.07.2012  | Scanner axes not orthogornal                                | ?                                                                 | Angle of around 0.2° between X and Y                                                                                                                           |+| 02.07.2012  | Scanner axes not orthogornal                                | We will need a new calibration                                    | Angle of around 0.2° between X and Y. {{:laser:reklamation_trumpf_kalibrierung.doc|Letter to TRUMPF}}                                                          | 
 +| 30.07.2012  | Security lamp broken                                        | Replaced                                                          | New lamps need to be ordered, placed order in conrad list                                                                                                      | 
 +| 24.07.2012  | Microscope objective 100T                           | Changed                   | Marking field is 50x50 mm, CAD-files need to be adjusted , new parameters have to be found  | 
  
  

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