Differences
This shows you the differences between two versions of the page.
Both sides previous revisionPrevious revisionNext revision | Previous revision | ||
uvlaser [2012/07/30 14:39] – brunne | uvlaser [2015/07/28 13:34] (current) – muellera | ||
---|---|---|---|
Line 17: | Line 17: | ||
=== How to use the machine === | === How to use the machine === | ||
- | The laser system is operated in the MA lab on the 2nd floor. If you want to use the machine, you need the approval | + | The laser system is operated in the MA lab on the 2nd floor. If you want to use the machine, you need the approval Prof. Wallrabe. After that you can get the introduction to the machine by the [[equipment|responsible person]]. It is split into two parts, the basic introduction and the introduction into alignment and stitching. Each introduction takes about 1.5h. The introduction notes can be downloaded here:\\ |
|{{: | |{{: | ||
Line 29: | Line 29: | ||
=== Known issues === | === Known issues === | ||
- | * The laser needs at least 30-40 minutes to warm up. After about 10-20 minutes it is possible to start lasing, however the machine doesn' | + | * The laser needs at least 60 minutes to warm up. After about 30 minutes it is possible to start lasing, however the machine doesn' |
* The laser loses power over time. This can be checked by a reference cut into silicon: The following parameters should cut through a piece of 300 µm Si wafer:\\ | * The laser loses power over time. This can be checked by a reference cut into silicon: The following parameters should cut through a piece of 300 µm Si wafer:\\ | ||
Line 80: | Line 80: | ||
| 02.07.2012 | | 02.07.2012 | ||
| 30.07.2012 | | 30.07.2012 | ||
- | + | | 24.07.2012 | |
- | + | ||